kerja0.my

Staff / Senior Lead Engineer, AI Hardware Product (manufactu

Job No. 4241791913 Manufacturing & Production Kulim Kulim Full Time Posted October 30, 2026 Closes November 29, 2026

Undisclosed

CELESTICA PLATFORM AND CLOUD SOLUTIONS MALAYSIA SDN. BHD. · 0.0 / 5 (0 company reviews)

About the Role We are seeking a high-caliber Staff /Senior Lead Engineer, AI Hardware Product, representing the manufacturing site. In this role, you will lead a taskforce of cross- functional experts

About the Role
We are seeking a high-caliber Staff /Senior Lead Engineer, AI Hardware Product,
representing the manufacturing site. In this role, you will lead a taskforce of cross-
functional experts from Design Team, Customer, key suppliers, manufacturing site
Process/Test/Debug/Quality Engineering to perform deep-dive failure root cause
analysis and drive robust Corrective and Preventive Actions (CAPA).
You are a rare technical hybrid possessing unique, multi-domain expertise: a deeper
understanding of semiconductor ICs/ASICs than anyone in Design Team or
manufacturing site; superior insight into manufacturing and test processes compared
to Design Team, suppliers, or customers; and stronger mastery of design and
schematics than anyone else at the manufacturing site.
Key Responsibilities
● New Technology Integration: Rapidly assimilate new technologies,
components, and architectural paradigms to assess technical feasibility,
manufacturability, and commercial viability.
● Design-to-Operations Bridge: Collaborate closely with R&D, Hardware,
Software, and Industrial Design teams to align product specifications with
operational capabilities.
● DFX Leadership: Drive Design for Manufacturability (DFM), Design for
Assembly (DFA), and Design for Test (DFT) reviews early in the product
development lifecycle to eliminate downstream operational bottlenecks.
● NPI & Process Development: Collaborate with Advanced Process Engineers
to pioneer and optimize advanced manufacturing processes and test solutions
for New Product Introduction (NPI) of next-generation products built on
cutting-edge AI ASICs, high-density PCBs, and advanced high-speed
connectors and cabling systems.
● NPI Execution & Ramp: Lead build planning (EVT/DVT/PVT), yield
improvement, product qualification, and mass-production ramp schedules
across internal engineering and operations teams.
● Root Cause Analysis & CAPA: Spearhead deep-dive investigation of
complex hardware, IC/ASIC, and component failure modes and implement
permanent CAPA.

● Cross-Functional Alignment: Serve as the central technical point of contact
across Product Management, Design Engineering, Supply Chain, Quality, and
Manufacturing Operations.
Required Qualifications
● Education: Bachelor’s or Master’s degree in Electrical and Electronics
Engineering, Mechanical Engineering, Systems Engineering, Computer
Engineering, or a related technical discipline.
● Experience: 10+ years of experience in Product Engineering, Hardware
Engineering, or Technical Leadership driving failure analysis, CAPA, and yield
improvement in high-tech manufacturing.
● Semiconductor & ASIC Expertise: Superior understanding of
semiconductor IC architecture, physics, and failure modes exceeding peer
expertise in Design Team and manufacturing site.
● Design & Process Mastery: Exceptional expertise in manufacturing and test
processes, exceeding that of design engineers, suppliers, and customers,
coupled with a comprehensive schematic and board design knowledge.
● Data-Driven Problem Solving: Strong analytical background skilled in root-
cause analysis, statistical process control, and yield analysis.
● Cross-Functional & Supplier Leadership: Proven experience leading
technical taskforces involving internal teams (Process, Test, Debug, Quality),
Design Team, customers, and key IC vendors.
● AI Data Center & Hyperscaler Architecture: Deep understanding of AI Data
Center architecture, current and emerging technologies surrounding
hyperscaler AI servers, switches, and storage, while continuously keeping
pace with future technology developments and market releases.
Preferred Qualifications
● Hands-on background as a Hardware Design Engineer, Manufacturing
Engineer, or Systems Engineer prior to moving into product management.
● Experience with Agile hardware development frameworks and product
lifecycle management (PLM) systems (e.g., Arena, Agile, Windchill).
● Track record of successfully launching high-volume or high-complexity
products in consumer electronics, automotive, industrial automation, or
medical devices.
Key Attributes for Success
● Agile & Adaptable: Thrives in fast-paced environments with constantly
evolving product specifications and emerging technology stacks.

● Decisive Leader: Able to make tough technical trade-off decisions under tight
schedule constraints without sacrificing product quality.
● Communicator: Translates complex technical challenges into clear strategic
priorities for executive leadership, operations teams, and external partners.

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